SECTOR 24 · ELECTRONICS & SEMICONDUCTORS
Electronics & Semiconductor Cleanroom HVAC
Ultra-clean ISO Class 4–6 cleanrooms, Electrostatic Discharge (ESD) humidity control, ULPA filtration, and micro-assembly dry air.
Key Air Engineering Focus Areas
Custom HVAC systems designed specifically for high operational performance, environmental compliance, and worker thermal comfort.
Semiconductor Micro-Assembly Cleanrooms
ISO Class 4 & Class 5 laminar airflow cleanrooms with ULPA filters (99.9995% efficiency @ 0.12 micron) for SMT lines.
ISO Class 4/5ULPA FiltrationESD Static Control Dehumidification
Maintaining precise 45% ± 3% RH to prevent Electrostatic Discharge (ESD) damage to sensitive microchips & PCB components.
ESD Static ControlRH 45% PrecisionAirborne Molecular Contaminant (AMC) Filters
Chemical gas phase filtration stripping trace organic vapors and dopant gases from cleanroom recirculated air.
AMC Chemical FilterZero Trace DopantsRegulatory Compliance & Engineering Standards
ULPA 99.9995%Ultra-low penetration air filters trapping sub-micron dust.
Vibration Free AHUsSpring isolated blowers preventing micro-lithography blur.
Raised Access FloorUnderfloor return air plenum for vertical laminar airflow.
Continuous Particle LogLaser particle counter monitoring integrated with BMS.
INDUSTRY FAQs
Frequently Asked Questions
What is the difference between HEPA and ULPA air filters?
HEPA filters trap 99.97% of particles down to 0.3 microns, while ULPA filters trap 99.9995% down to 0.12 microns for semiconductor cleanrooms.
Why is 45% relative humidity critical for PCB assembly cleanrooms?
Air drier than 40% RH causes static electricity buildup that destroys microchips, while humidity above 55% causes solder paste oxidation and component corrosion.
Need a Custom HVAC Design for Your Facility?
Consult with our senior application engineers in Vatva, Ahmedabad today.